60 Series, Summit SIPT

60 Series, Summit Module w/u.FL, USB/USB

60 Series, Summit SIPT

The ARM® Cortex™ M0+ MCU processes BLE software stacks and user’s application software The Cortex™-M0+ core ensures high efficiency and low power. With RF and modem, this SoC supports BLE 125K/500K/1M/2M bps data rates. ASR5601N-ML is designed to meet various kinds of IoT applications such as the data transmission, the remote controller and the speech recognition. OTP is integrated in order to enhance the system's security

AzureWave Technologies, Inc. introduces the advanced IEEE 802.11 b/g/n WLAN module - AWNM288SM. The module is targeted to mobile and embedded devices which need small footprint package, low power consumption, and multiple OS support. The module supports 2.4GHz IEEE 802.11n MAC/baseband/radio. It also features an integrated Power Management Unit (PMU), Power Amplifiers (PAs), and a Low Noise Amplifier (LNA) to address the needs of mobile devices that require minimal power consumption and compact size.

Easy-to-deploy Access Point suitable for diverse indoor wall-/ceiling-mount scenarios.

The Wi-Fi 6 ready DAP-X2810/50 is on hand to provide unbeatable speeds, greatly increased capacity and interference-free coverage throughout businesses, paired with the easy management of Connect.

SDIO 802.11a/b/g/n, Dev Kit

DVK, 60 Series, Sterling Module w/u.FL

DVK, 60 Series, Sterling SIPT

802.11a/b/g/n 2x2-BT 4.0, Dev Kit

REYAX’s RYWB116_Lite DIP module provides a comprehensive multi-protocol wireless solution including 802.11 b/g/n, dual-mode Bluetooth 5.

Dev Kit, Sterling LWB5+, MHF4

Dev Kit, Sterling LWB5+, M.2, E-Key, USB, USB