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RAK3172 Breakout Board

RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers.

  • Frequency band

SG$ 20.11

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Lead Time : 3.0 weeks

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RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers.

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Rakwireless

RAKwireless is an industrial-leading connectivity provider that builds infrastructures and Modular Edge devices for IoT, Smart City, and Smart Agriculture markets with in-house developed solutions, utilizing LPWA (Low Power Wide Area) technologies.


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Overview

RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers.

The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip, It has Ultra-Low Power Consumption of 1.69uA in sleep mode

This module complies with Class A, B & C of LoRaWAN 1.0.3 specifications. It also supports LoRa Point to Point (P2P) communication mode which helps you in implementing your own customized long-range LoRa network quickly.

Features

  • Based on RAK3172
  • I/O ports: UART/I2C/GPIO/SPI
  • Serial Wire Debug (SWD) interface
  • Module size: 25.4 x 32.3 mm
  • Supply Voltage: 2.0 V ~ 3.6 V
  • Temperature Range: -40° C ~ 85° C

Application

Specifications for RAK3172 Breakout Board

Frequency band AS923 or AU915 or EU868 or IN865 or KR920 or US915
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Product Description

RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers.

The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip, It has Ultra-Low Power Consumption of 1.69uA in sleep mode

This module complies with Class A, B & C of LoRaWAN 1.0.3 specifications. It also supports LoRa Point to Point (P2P) communication mode which helps you in implementing your own customized long-range LoRa network quickly.

Product Features

  • Based on RAK3172
  • I/O ports: UART/I2C/GPIO/SPI
  • Serial Wire Debug (SWD) interface
  • Module size: 25.4 x 32.3 mm
  • Supply Voltage: 2.0 V ~ 3.6 V
  • Temperature Range: -40° C ~ 85° C

Product Inclusion

  • 1pc RAK3272S Breakout Board
  • 1pc LoRa® antenna with RP-SMA female connector
  • 18pcs Dupont lines
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