The ASR6505 is a general LoRa Wireless Communication Chipset, with integrated LoRa Radio Transceiver, LoRa Modem and an 8-Bit CISC MCU. The MCU uses an advanced STM 8-bit core, with 16MHz operation frequency. The LoRa Radio Transceiver has continuous frequency coverage from 150MHz to 960MHz. The LoRa Modem supports LoRa modulation for LPWAN use cases and (G)FSK modulation for legacy use cases. The LoRa Wireless Communication module designed by ASR6505 provides ultra long range and ultra low power communication for LPWAN application.

The ASR6501 is a general LoRa Wireless Communication Chipset, with integrated LoRa Radio Transceiver, LoRa Modem and a 32-bit RISC MCU.

RAK3172-SiP is a low-power long range transceiver system in a package (SiP) that is based on STM32WLE5CC chip. It provides an easy to use, small size, low-power solution for long range wireless data applications. This module complies with Class A, B & C of LoRaWAN 1.0.3 specifications.

The RAK3172 LoRa Module includes a STM32WLE5CC chip, which supports eight (8) spreading factors (SF5 ~ SF12) and signal bandwidth that can be adjusted between 7.8 kHz to 500 kHz. It has Ultra-Low Power Consumption of 1.69 μA in sleep mode, but during the Transmit Mode, it can reach the maximum output power of 22 dBm. As a receiver, it can achieve a sensitivity of -148 dBm.

RAK4200 LoRa® Module includes an STM32L071 MCU and an SX1276 LoRa® chip.

The RAK4260 LPWAN Module is based on Microchip's ATSAMR34J18B. It is a SiP device integrating a 32-bit ARM Cortex -M0+ MCU with a LoRa Transceiver in a compact surface mount package.

LoRaWAN BLE5.0 LPWAN Module

With Semtech® SX1276 at its core, the RAK811(WisDuo LPWAN Module) takes advantage of all LoRa® features. Long-range, low power consumption is at its core.

RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers.

RAK811 LPWAN Breakout Module is a combination of the RAK811 chipset and the RAK811 Breakout Board. It is a barebone LoRa® Node solution which is a balance between small size and access to GPIOs via a header.

5.5V module Radial lead plastic case 1F

5.5V module Radial lead plastic case 1.5F

Intelligent LoRa/BLE Module [915MHz LoRa for US] smartBASIC, Module

5.5V module Radial lead plastic case 1F

RAK4260 breakout board

This is a bundle of WisBlock Base RAK5005-O and WisBlock Core RAK4631

RAK4260 LPWAN Evaluation Board is a WisDuo product that consists of RAK4261 (RAK4260 LPWAN Module + Breakout board) and the RAK5005 WisBlock Base.

5.5V module Radial lead plastic case 1.5F

The Dragino LWL02 is a LoRaWAN Water Sensor. When there is water between the two metal probes, LWL02 indicates a water leak event and uplink to IoT server via LoRaWAN network.

The Dragino LDS02 is a LoRaWAN Door Sensor. It detects door open/close status and uplink to IoT server via LoRaWAN network. user can see the door status, open time, open counts in the IoT Server.