RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers.

5.5V module Radial lead plastic case 1F

RAK3172-SiP is a low-power long range transceiver system in a package (SiP) that is based on STM32WLE5CC chip. It provides an easy to use, small size, low-power solution for long range wireless data applications. This module complies with Class A, B & C of LoRaWAN 1.0.3 specifications.

The RAK3172 LoRa Module includes a STM32WLE5CC chip, which supports eight (8) spreading factors (SF5 ~ SF12) and signal bandwidth that can be adjusted between 7.8 kHz to 500 kHz. It has Ultra-Low Power Consumption of 1.69 μA in sleep mode, but during the Transmit Mode, it can reach the maximum output power of 22 dBm. As a receiver, it can achieve a sensitivity of -148 dBm.