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Sterling 70 Series - Dual-Band 2x2 Wi-Fi 6 + Bluetooth

    SG$ 23.61

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    Laird


    We simplify the rapid integration of wireless connectivity with innovative solutions, world-class manufacturing and unparalleled customer support. Our culture creates a fast moving, flexible work environment attracting employees who focus on providing accelerated profitable growth. Our vision is to be the technology behind every innovative and reliable wireless solution by 2025.


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    Overview


    Laird Connectivity’s customers across multiple industries have a diverse set of requirements and specific needs. They asked for a high-performance, robust, industrial wireless IoT module: one that’s rugged, simplifies their BOM, is globally certified, has reliable connectivity, and easy to integrate.


    Our new Sterling 70 series answers call for next-generation Wi-Fi 6 (802.11ax) connectivity. Powered by NXP’s innovative 88W9098 silicon, the Sterling 70 is purpose-built for industrial IoT connectivity through a secure, reliable, and robust feature set. Its performance IoT from the start: fully certified, easy to integrate, and is the fastest route to the market for IoT.

    Features

    • Reliable: Integrated PA (Power Amplifier) and LNA (Low Noise Amplifier) with 2x2 MU-MIMO for reliable connectivity in harsh RF environments.

    • Multi Wireless: Rich feature-set including latest 802.11ax Wi-Fi, simultaneous dual-band 2.4 and 5 GHz, Dual-Mode Bluetooth including LE Long Range.

    • Robust: With an industrial temperature range and solder-down module, is suitable for industrial vibration and impact demands.

    • Compatible: Open source, MPU-neutral software including Linux Backports and a Yocto layer ensures broad kernel and BSP compatibility. Native support for NXP’s latest i.MX 6/7/8 evaluation kits and Linux BSPs. 

    • Secure: Supports the latest WPA3-Personal and WPA3-Enterprise security standards.

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    Laird Connectivity’s customers across multiple industries have a diverse set of requirements and specific needs. They asked for a high-performance, robust, industrial wireless IoT module: one that’s rugged, simplifies their BOM, is globally certified, has reliable connectivity, and easy to integrate.

    Our new Sterling 70 series answers call for next-generation Wi-Fi 6 (802.11ax) connectivity. Powered by NXP’s innovative 88W9098 silicon, the Sterling 70 is purpose-built for industrial IoT connectivity through a secure, reliable, and robust feature set. Its performance IoT from the start: fully certified, easy to integrate, and is the fastest route to the market for IoT.

    • Reliable: Integrated PA (Power Amplifier) and LNA (Low Noise Amplifier) with 2x2 MU-MIMO for reliable connectivity in harsh RF environments.
    • Multi Wireless: Rich feature-set including latest 802.11ax Wi-Fi, simultaneous dual-band 2.4 and 5 GHz, Dual-Mode Bluetooth including LE Long Range.
    • Robust: With an industrial temperature range and solder-down module, is suitable for industrial vibration and impact demands.
    • Compatible: Open source, MPU-neutral software including Linux Backports and a Yocto layer ensures broad kernel and BSP compatibility. Native support for NXP’s latest i.MX 6/7/8 evaluation kits and Linux BSPs. 
    • Secure: Supports the latest WPA3-Personal and WPA3-Enterprise security standards.

    • Specifications

      Wireless Specification
      Wi-Fi 6 (802.11ax)
      Bluetooth 5.1
      Chipset (Wireless)
      NXP 88W9098
      Dimensions
      18 x 20 x 2.8 mm (SiP Modules)
      22 x 30 x 3.1 mm (M.2 E-Key Cards)
      Additional Features
      Wi-Fi: 802.11 a/b/g/n/ac/ax, dual-radio, 20-40-80 MHz support, MU-MIMO, OFDMA, Transmit Beamforming
      Bluetooth: Classic Bluetooth, Bluetooth LE, 2x Wideband Speech links (WBS), Central/Peripheral Modes, Up to 16x LE connections, LE Secure Connections, 2MPHY, LE Coded (Long Range)
      Antenna Options
      3x MHF4 (M.2 Board)
      3 Trace Pins (SiP Module)
      Bluetooth Version
      5.1
      BT Interfaces
      UART
      Certifications
      FCC, ISED, EU, MIC, RCM
      Development Tools
      Development board, accessories, and evaluation software
      Form Factor
      Rugged SiP module or M.2 2230 E-Key
      Frequency (Wi-Fi)
      2.4 & 5 GHz
      Operating Temp (°C)
      -40 °C - +85 °C
      OS/Software
      Out of Box support for NXP i.MX 6/7/8 BSP, Linux Backports, Yocto Layer for Yocto BSP
      Wi-Fi Interfaces
      PCIe 2.0
      SDIO 3.0
      Wi-Fi Spec
      2x2 MU-MIMO Wi-Fi 6 (802.11AX)
      Dual independent WLAN radios, dual MAC and dual baseband
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