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Sterling-LWB5 Dual-Band WiFi Module with Bluetooth 4.2

Sterling-LWB SIP, Cut Tape

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Sterling-LWB SIP, Cut Tape


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Laird


We simplify the rapid integration of wireless connectivity with innovative solutions, world-class manufacturing and unparalleled customer support. Our culture creates a fast moving, flexible work environment attracting employees who focus on providing accelerated profitable growth. Our vision is to be the technology behind every innovative and reliable wireless solution by 2025.


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Overview

The Sterling-LWB5 dual-band Wi-Fi, Bluetooth® Smart, and Bluetooth® Smart Ready module offers significant value to developers by providing an unmatched breadth of options, certifications, and antenna options, which altogether provide greater flexibility to meet the challenging requirements of many wireless designs. This certified module is based on the Cypress (formerly Broadcom) CYW43353 chipset to create one of the very first commercially available solutions that offers IEEE 802.11ac capabilities for ultra-high data rate 5 GHz Wi-Fi connectivity, while also featuring classic Bluetooth and BLE connectivity as well. The module comes in three configurations to best address specific applications, each boasting an industrial temperature rating (-40° to +85° C) and an industry-leading range of certifications and antenna options.

Features

  • IEEE 802.11 a/b/g/n/ac (single stream n)

  • Typical WLAN Transmit Power:

    • +16 dBm, 11 Mbps, CCK (b)

    • +13 dBm, 54 Mbps, OFDM (g)

    • +11 dBm, HT20 MCS7 (n)

  • Typical WLAN Sensitivity:

    • -87 dBm, 8% PER,11 Mbps (b)

    • -73 dBm, 10% PER, 54 Mbps (g)

    • -71 dBm, 10% PER, MCS7 (n)

  • Bluetooth 2.1+EDR, Bluetooth 3.0, Bluetooth 4.2 (Bluetooth Low Energy)

  • WLAN and Bluetooth coexistence

  • Available in two footprint styles:

  • – Easy to Integrate: 15.5 mm x 21 mm

  • – Miniature footprint: 10 mm x 10 mm

  • Available with integrated chip antenna or U.FL connector for external antenna

  • Operating voltage: VBAT = 3.20V to 3.60V

  • VDDIO = 1.71V to 1.89V

  • Operating temperature: -40 to +85o C

  • Compact design based on Cypress BCM43353 SoC

  • Worldwide acceptance: FCC (USA), ISED (Canada),EU, MIC (Japan) and AS/NZS

  • BT SIG QDID: 97564

  • REACH and RoHS compliant

Specifications for Sterling-LWB5 Dual-Band WiFi Module with Bluetooth 4.2

Package SIPT or Integrated Antenna or U.FL
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Dual-Band 802.11ac WiFi + Bluetooth v4.2 Combo Module

The Sterling-LWB5 dual-band Wi-Fi, Bluetooth® Smart, and Bluetooth® Smart Ready module offers significant value to developers by providing an unmatched breadth of options, certifications, and antenna options, which altogether provide greater flexibility to meet the challenging requirements of many wireless designs. This certified module is based on the Cypress (formerly Broadcom) CYW43353 chipset to create one of the very first commercially available solutions that offers IEEE 802.11ac capabilities for ultra-high data rate 5 GHz Wi-Fi connectivity, while also featuring classic Bluetooth and BLE connectivity as well. The module comes in three configurations to best address specific applications, each boasting an industrial temperature rating (-40° to +85° C) and an industry-leading range of certifications and antenna options.

Specifications

BT Capable
4.2
BT Chipset
Combo
BT Dual Mode
Yes
BT Interfaces
UART
Dimensions (H x L x W)
1.2 mm x 10 mm x 10 mm
Line
Professional
Operating Temp (°C)
-40 °C - +85 °C
Spatial Streams
SISO
Wi-Fi Chipset
BCM 43353
Wi-Fi Interfaces
SDIO
Wi-Fi Spec
a/b/g/n/ac