Laird Connectivity’s customers across multiple industries have a diverse set of requirements and specific needs. They asked for a truly robust industrial IoT module: one that’s rugged, small, simplifies their BOM, is globally certified, has reliable connectivity, and easy to integrate.

Laird Connectivity’s new Sterling-LWB5+ answers call for next-gen wireless IoT. Powered by Infineon’s CYW4373E silicon, the Sterling-LWB5+ is purpose-built for IIoT connectivity through a secure, reliable, and robust feature set. It’s IoT from the start: fully certified, easy to integrate, and is the fastest route to the market for IoT.

• Purpose Built:  Made with manufacturability in mind, and pre-certified to cut down barriers to entry.  
• Compatible: Our Linux Backports package supports many Linux kernels.
• Reliable:  Integrated PA (Power Amplifier) and LNA (Low Noise Amplifier) with antenna diversity for reliable connectivity in harsh RF environments.
• Robust:  Rich feature-set including 802.11ac Wi-Fi and Dual-Mode Bluetooth Low Energy. Reliable in the industrial temperature range, and the solder-down module is suitable for industrial vibration and impact demands.
• Secure:  Supports the latest WPA3 security standards.
  
  

• Specifications

  Wireless Specification

  Wi-Fi 5 (802.11ac)
  Bluetooth 5.2 Low Energy

  Chipset (Wireless)

  Infineon CYW4373E

  Dimensions (W x L)

  12 mm x 17 mm

  Antenna Options

  Chip antenna or MHF4 connector

  Certifications

  FCC, ISED, CE, MIC, RCM

  Form Factor

  Solderable module or M.2 E-key Module

  Output Power

  Integrated power amplifier and low noise amplifier

  Wi-Fi Coexistence

  Integrated coexistence